In this paper a FE-model for a family of high power LED is developed, i.e. To predict upfront in the product development process the lifetime of LED modules, calibrated finite element (FE) models are used. Transient thermal analysis (TTA) is widely used to measure the transient thermal impedance (Zth) and the thermal resistance of LEDs because reliability and lifetime of LED depends critically on junction temperature. The thermal performance of the thermal interfaces is significantly overestimated when using the maximum temperature for post-processing. A significant difference of 20% between the thermal resistances of the thermal interface layers is obtained. The calibration of the FE model is done using the average and the maximum temperature value of the EPI from the FE simulation. The heat load distribution influences the Zth(t) curve significantly from the µs- to the ms-time range and must be considered as important parameter when fitting the simulation model. Due to the phosphor conversion, the heat load must be divided on the epitaxial layer (EPI) and the phosphor.

The FE model is fitted to the experimental data.

using the Zth(t) curve and its logarithmic time derivation b(z). The calibration is done in the time-domain, i.e. different number of LED dies on ceramic sub-mounts of different sizes, is developed using ANSYS and calibrated to the Zth(t) curve measured by TTA. A FE-model for a family of white high-power LED, i.e.

Using a test chip, it is demonstrated that post-processing the average temperature of the junction of the FE model is the appropriate approach to correlate the simulated transient temperature data to the Vf(t) measurements. In this paper, the correlation between simulated transient temperature data and the experimentally by TTA measured forward voltage (Vf(t)) is analysed in detail. To predict the junction temperature of an LED in an application during product design and development calibrated finite element (FE) models are required. Transient thermal analysis (TTA) is widely used to measure the transient thermal impedance Zth and the thermal resistance Rth of LEDs to access the junction temperature. Reliability and lifetime of LED modules depend critical from drive current and junction temperature.

Ims post processor crack